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Last Updated : 2003/07/03

PRODUCTION PROCESS & MACHINERY

1) Board Design 2) CAM 3) Photoplotting
The PCB starts as a schematic diagram. The diagram are then furter tranlate into circuit pattern usuing PCB CAD. (Usuaully done by the customer)

Cutomer then send the data to PCB shop generate by CAD usually in Gerber format and we checked for manufacturability and arranged in a suitable manner for manufacture.

A laser photoplotter is then used to produce the working film. The film usually consist of the circuit, soldermask, and silkscreen layer.
4) Drilling 5) Electroless Plating 6) Image Transfer
Holes are drilled into the copper clad laminate using CNC drilling machines (File Format : Excellon or ASIC) thin wall of electroless copper is plated in the holes to provide electrical continuity through the drilled holes. Photosensitive film is laminated onto the PCB and the photographic pattern is exposed and developed from the surface.
7) Electrolytic Plating 8) Etching 9)Screen Printing
The circuitry and holes are plated with 25-30 microns of copper and 10 microns of tin lead plate. The copper that is not required is etched off to leave the desired circuit. The solder mask is screen printed onto the board as a dialetric to protect and aid component placing
10) Hot Air Leveling 11) Profiling 12) Electrical Test
The copper areas of the pads and holes are coated with an even layer of tin/lead to aid soldering. Boards are either V-scored, routed, or punch according to customers requirement. All boards are 100% visually inspected or electrical tested if cutomer req

Address : 71/15 Bangna Trad Road 52 Km. Takham Bangpakong, Chachoengsao 24130 Thailand
TEL : 66+38+573058 FAX : 66+38+573057

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